Wafer punching machine
Name: Wafer punching machine
Manufacturer: U.S. GATAN Company
Purchasing date: April 4, 2008
Main technical indicators:
1. Punching diameter: 3mm
2. Cutting thickness: 10μm ~ 100μm
3. applicable to metals, alloys and other materials with ductility and toughness
Common accessories: None
The main application area: transmission sample preparation
Main function: cut the malleable material (such as metal) into wafer with a diameter of 3mm
Person in charge of the equipment: Zhang Weina
Ways of contact:
Tel: 13604028597 024-83686411
E-mail:
Location: Room 101, RAL
Operation Rules
- Grind the sample with sandpaper to 50 ~ 80 microns;
- Place the sample in the punching groove and target at the required drilling location;
- Press the drilling machine handle, and take out the wafer from the groove.